This book presents the necessary concepts for the design and testing of radiofrequency and high-speed circuits. Signal and propagation theory is presented for the various circuit levels, from the chip to the PCB. The co-existence of high-speed wideband signals of radiofrequency signals and supply circuits is developed in order to provide design rules for engineers and Masters-level students. The subjects covered include: interconnections and signal integrity; spectral analysis techniques for high-speed signals; design techniques for signal integrity; the transmission-line concept; methods for temporal analysis and techniques for frequency domain analysis for connectics.



Autorentext

Fabien Ndagijimana is Professor at Minatec, Grenoble, France.

Inhalt

INTRODUCTION ix

CHAPTER 1. DEGRADATION OF RISE TIME IN INTERCONNECTS 1

1.1. Propagation issues in interconnects 1

1.1.1. Evolution of digital circuits 1

1.1.2. Evolution of signals in interconnects 2

1.1.3. Propagation time on networks 4

1.1.4. Propagation delay in integrated circuits 5

1.1.5. Spectral analysis of signals 6

1.2. Behavior of components at high frequencies 7

1.2.1. Contact wire behavior 7

1.2.2. Resistance behavior at radiofrequencies (RF) 8

1.2.3. RF inductance behavior 8

1.2.4. Capacitance behavior at RF 9

1.2.5. Effects of losses due to conductors: skin effect 11

1.3. Effect on transmission of signals on interconnects 13

1.3.1. Filtering by transmission channel 13

1.3.2. Degradation of rise time in a limited-bandwidth channel 14

1.3.3. Example of a first-order low-pass RC filter 15

1.3.4. Effects of resistive losses from skin effect 16

1.3.5. Rise time in cascading circuits 17

1.3.6. Transmission quality criteria: eye diagram 19

1.4. Measurement of rise time 19

1.4.1. Different definitions of rise time 19

1.4.2. Measurement principle 20

1.4.3. Effect of measuring sensor 20

1.5. Conclusion 21

CHAPTER 2. ELECTROMAGNETIC MODELING OF INTERCONNECTS 23

2.1. Global modeling of signal integrity 23

2.1.1. ICEM and ICIM models 23

2.1.2. IBIS models 24

2.1.3. I/V characteristics of buffers 25

2.1.4. I/V characteristics of the IBIS model 25

2.2. RC interconnect model 27

2.2.1. RC model 27

2.2.2. The Elmore constant 28

2.3. Capacitive and inductive modeling 28

2.3.1. Capacitive modeling 29

2.3.2. Inductive modeling 30

2.4. LC line modeling 35

2.5. Application to electronic packages and MCM 37

2.5.1. Different types of electronic packages 37

2.5.2. Multichip modules 39

2.5.3. LC modeling of packages 40

2.5.4. 2.5D and 3D electromagnetic simulations 43

2.6. Conclusion 45

CHAPTER 3. CONTROLLED IMPEDANCE INTERCONNECTS 47

3.1. Why control impedance? 47

3.1.1. Effect of interconnect length 47

3.1.2. Classification of interconnects by the signal carried 51

3.2. Influence of rise time on signal degradation 52

3.3. Model of a controlled impedance interconnect 53

3.3.1. Characteristic impedance: definition 53

3.3.2. Configuration of controlled impedance interconnects 54

3.4. Interconnects on PCBs 55

3.4.1. Controlled impedance on PCB 55

3.4.2. Transition between lines and discontinuity 57

3.4.3. Extraction of values from equivalent schema 60

3.5. Impedance control for a microstrip configuration 61

3.5.1. Effect of effective permittivity 61

3.5.2. Limitations on a typical digital circuit 62

3.5.3. Effect of ribbon thickness or protective resin 63

3.6. Analysis of propagation in interconnects 64

3.6.1. Reflection and transmission on termination 64

3.6.2. Reflection and transmission during an impedance break 65

3.6.3. Reflection and transmission on a bus 66

3.7. Effect on data bus configuration 68

3.8. Application to clock distribution 69

3.9. Conclusion 71

CHAPTER 4. PROPAGATION ON TRANSMISSION LINES 73

4.1. Transmission line model 73

4.1.1. Modes of propagation on lines 74

4.2. Propagation modes related to substrate 76

4.2.1. Quasi-TEM mode 77

4.2.2. Skin-effect mode 78

4.2.3. Slow wave mode 79

4.2.4. Transition zone 80

4.3. Equation of propagation on transmission lines 81

4.3.1. Propagation equation 82

4.3.2. Input impedance 85

4.3.3. Interconnect behavior according to length and loads 85

4.3.4. Case of electrically short lines 86

Titel
Signal Integrity
Untertitel
From High-Speed to Radiofrequency Applications
EAN
9781118649206
ISBN
978-1-118-64920-6
Format
E-Book (epub)
Hersteller
Herausgeber
Veröffentlichung
02.06.2014
Digitaler Kopierschutz
Adobe-DRM
Dateigrösse
8.22 MB
Anzahl Seiten
176
Jahr
2014
Untertitel
Englisch