Advanced CMOS Process Technology is part of the VLSI Electronics Microstructure Science series. The main topic of this book is complementary metal-oxide semiconductor or CMOS technology, which plays a significant part in the electronics systems. The topics covered in this book range from metallization, isolation techniques, reliability, and yield.
The volume begins with an introductory chapter that discusses the microelectronics revolution of the 20th century. Then Chapter 2 puts focus on the CMOS devices and circuit background, discussing CMOS capacitors and field effect transistors. Metallization topics and concepts are covered in Chapter 3, while isolation techniques are tackled in Chapter 4. Long-term reliability of CMOS is the topic covered in Chapter 5. Finally, the ability of semiconductor technology to yield circuits is discussed in Chapter 6.
The book is particularly addressed to engineers, scientists, and technical managers.

Preface
Chapter 1 Introduction

Chapter 2 CMOS Device and Circuit Background

I. Junction Diode

II. Metal-Oxide-Semiconductor Capacitor

III. Metal-Oxide-Semiconductor Field Effect Transistor

IV. Circuit Considerations

V. CMOS Latch-up

References

Chapter 3 Metallization

I. Gate Electrodes

II. Reduction in Device Parasitics

III. Interconnections

IV. An Application of Advanced Metallization Technology

V. Summary

References

Chapter 4 Isolation Techniques

I. Introduction

II. Device Isolation

III. Well Isolation

IV. Dielectric Isolation

References

Chapter 5 Reliability

I. Channel Hot Electron Degradation

II. Electromigration

III. Oxide Wear-out

References

Chapter 6 Yield

I. Yield Basics

II. Sources and Classification of Yield Loss

III. Yield Enhancement Methodology

References

Index