A solid collection of interdisciplinary review articles on the latest developments in adhesion science and adhesives technology
With the ever-increasing amount of research being published, it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in many subjects representing the field of adhesion science and adhesives.
Based on the success of the preceding volumes in this series "Progress in Adhesion and Adhesives"), the present volume comprises 9 review articles published in Volume 6 (2018) of Reviews of Adhesion and Adhesives.
The subject of these reviews fall into the following general areas:
1. Adhesion to wood and wood bonds
2. Adhesive joints
3. Adhesion in microelectronic packaging
4. Surface modification
5. Contact angle, wettability and surface free energy.
The topics covered include: Adhesion phenomena in microelectronic packaging; adhesives for wood and lignocellulosic materials; adhesion to wood and lignocellulosic materials; adhesively bonded lap joints having bi-adhesive and modulus-graded bondlines; adhesion between compounded elastomers; applications of contact angle measurements in pharmaceuticals and foods; oxygen or ammonia plasma treatment of polyolefin surfaces; surface free energy determination of powders and particles; wood bonds; and dispersion adhesion forces between macroscopic objects.
Autorentext
Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Sk??odowska University, Lublin, Poland. He is the editor of more than 130 books dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives.
Inhalt
Preface xiii
1 Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical Review 1
Dinesh P R Thanu, Aravindha Antoniswamy, Roozbeh Danaei and Manish Keswani
1.1 Introduction 2
1.2 Polymer Thermal Interface Material -Metal Interface Adhesion Phenomena 3
1.2.1 Basics of Thermal Interface Material Adhesion 3
1.2.2 Current Status of Thermal Interface Materials and their Bonding Mechanisms 5
1.2.3 Chemical Bonding 6
1.2.4 Mechanical Interlocking 12
1.2.5 Weak Boundary Layer 14
1.3 Ball Grid Array Solder Attach Adhesion Phenomena 14
1.3.1 Solder Alloy Selection 15
1.3.2 Flux Selection 18
1.4 Summary 19
Nomenclature 20
References 21
2 Influence of Silicon-Containing Compounds on Adhesives for and Adhesion to Wood and Lignocellulosic Materials: A Critical Review 25
Marko Petric
2.1 Introduction 26
2.2 An Overview of Compounds and Natural Minerals Containing the Element Si, which are the Most Relevant in the Science and Technology of Lignocellulosics 29
2.2.1 Silica SiO2 29
2.2.2 Silicates and Clay 30
2.2.3 Silicones 32
2.2.4 Silanes and Silsesquioxanes 33
2.3 Si-containing Compounds in Adhesives and in Lignocellulosic Substrates and their Influence on the Performance of Adhesive Bonds 35
2.3.1 Compounds of Silicon in Adhesives 35
2.3.1.1 Inorganic Compounds of Si (Silica, Silicates, Clay, and Other Inorganic Compounds) 35
2.3.1.2 Organosilicon Compounds in Adhesives 40
2.3.2 Silicon-containing Compounds in Lignocellulosics with Regard to the Properties of Adhesive Bonds 42
2.3.3 Influence of Si in Coatings or in Lignocellulosic Substrates with Regard to Coatings Adhesion to the Substrates 44
2.4 Interactions of the Si Compounds with Lignocellulosics 46
2.4.1 Interactions with Silica 46
2.4.2 Interactions with Silicates 48
2.4.3 Interactions with Silicones 49
2.4.4 Interactions with Organosilicon Compounds and Coupling Agents 50
2.4.4.1 Interactions with Organosilicon Compounds 50
2.4.4.2 Coupling Agents 52
2.5 Wood- and Lignocellulose-based Composites Containing Si Compounds 57
2.5.1 Composites Containing Silica 57
2.5.2 Composites Containing Silicates and Clay 59
2.5.3 Composites Containing Silicones 60
2.5.4 Composites with Organosilicon Compounds 61
2.6 Summary and General Remarks 64
2.7 Acknowledgments 65
References 65
3 Recent Advances in Adhesively Bonded Lap Joints Having Bi-Adhesive and Modulus-Graded Bondlines: A Critical Review 77
Özkan Öz and Halil Özer
3.1 Introduction 77
3.2 Bi-adhesive Joints 80
3.2.1 Numerical and Analytical Studies 80
3.2.2 Experimental Studies 84
3.3 Modulus-Graded Bondline 88
3.3.1 Numerical and Analytical Studies 88
3.3.2 Experimental Studies 91
3.4 Summary 94
Acknowledgement 94
Nomenclature 94
References 94
4 Adhesion between Compounded Elastomers: A Critical Review 99
K. Dinesh Kumar, M.S. Satyanarayana, Ganesh C. Basak and Anil K. Bhowmick
4.1 Introduction 100
4.2 Co-crosslinking 101
4.2.1 Adhesion Between Unvulcanized Rubber (Filled with Crosslinking Agents) and Unvulcanized Rubber (Filled with Crosslinking Agents) by Co-crosslinking 104
4.2.2 Adhesion Between Partially Vulcanized Rubber (Filled with Crosslinking Agents) and Partially Vulcanized Rubber (Filled with Crosslinking Agents) by Co-crosslinking 118
4.3 Adhesion Between Vulcanized Rubber and Unvulcanized Rubber or Partially Vulcanized Rubber 138
4.3.1 Adhesion between Vulcanized Rubber and Unvulcanized Rubber (Filled with Crosslinking Agents) 140
4.3.2 Adhesion between Vulcanized Rubber and Partially Vulcanized Rubber (Filled with Crosslinking Agents) 164&l...