Must-have reference on electronic packaging technology!
The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration.
The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.
Autorentext
King-Ning Tu, PhD, is TSMC Chair Professor at the National Chiao Tung University in Taiwan. He received his doctorate in Applied Physics from Harvard University in 1968.
Chih Chen, PhD, is Chairman and Distinguished Professor in the Department of Materials Science and Engineering at National Yang Ming Chiao Tung University in Taiwan. He received his doctorate in Materials Science from the University of California at Los Angeles in 1999.
Hung-Ming Chen, PhD, is Professor in the Institute of Electronics at National Yang Ming Chiao Tung University in Taiwan. He received his doctorate in Computer Sciences from the University of Texas at Austin in 2003.
Klappentext
Discover a comprehensive exploration of the materials science and technology of electronic packaging
In Electronic Packaging Science and Technology, an expert team of researchers delivers an insightful presentation of the modern state of electronic packaging and the role it plays in moving technology forward. The authors provide an overview of electronic packaging and provide the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding.
The book also offers descriptions of the concepts and theory of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. Finally, the authors provide descriptions of the current state of the science of electronic packaging and its reliability.
The authors include real-world case studies at the end of each chapter to reinforce and illustrate the concepts contained within. The book also includes:
- A thorough introduction to the state-of-the-art of electronic packaging, including the impact of big data and discussions of packaging techniques
- A comprehensive exploration of electrical circuits in electronics packaging, including the principles of electronic circuit design, the design of redistribution layers, and the design of low power devices and circuits
- A practical discussion of the science of electronic packaging, including Joule heating, reliability issues in packaging technology, and solid-state reactions intrinsic diffusivity
Perfect for scientists and engineers in research and industry labs, Electronic Packaging Science and Technology will also earn a place in the libraries of advanced undergraduate and graduate students studying materials science, physics, and electrical engineering.
Zusammenfassung
Must-have reference on electronic packaging technology!
The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration.
The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.
Inhalt
Preface
Chapter 1 Introduction
1.1 Introduction
1.2 Impact of Moore's law on Si technology
1.3 5G technology and AI applications
1.4 3D IC packaging technology
1.5 Reliability science and engineering
1.6 The future of electronic packaging technology
1.7 Outline of the book
References
Figures Caption
Part I (Chapter 2 to Chapter 5)
Chapter 2 Cu-to-Cu and Other Bonding Technologies in Electronic Packaging
2.1 Introduction
2.2 Wire bonding
2.3 Tape automated bonding
2.4 Flip chip solder joint bonding
2.5 Micro-bump bonding
2.6 Cu-to-Cu direct bonding
2.6.1 Critical factors for Cu-to-Cu bonding
2.6.2 Analysis of Cu-to-Cu bonding mechanism
2.6.3 Microstructures at the Cu-to-Cu bonding interface
2.7 Hybrid bonding
2.8 Reliability - Electromigration and temperature cycling tests
References
Figures Caption
Problem
Chapter 3 Randomly Oriented and (111) Uni-directionally Oriented Nanotwin Copper
3.1 Introduction
3.2 Formation mechanism of nanotwin Cu
3.3 In-situ measurement of stress evolution during nano-twin deposition
3.4 Electrodeposition of randomly-oriented nanotwin copper
3.5 Formation of uni-directionally (111)-oriented and nanotwin copper
3.6 Grain growth of [111] oriented nt-Cu
3.7 Uni-directional growth of -Cu6Sn5 in microbumps on [111] oriented nt-Cu
3.8 Low thermal-budget Cu-to-Cu bonding using [111]-oriented nt-Cu
3.9 Nanotwin Cu redistribution layer for fanout package and 3D integration
References
Figures Caption
Problems
Chapter 4 Solid-Liquid Interfacial Diffusion Reactions (SLID) between Copper and Solder
4.1 Introduction
4.2 Kinetic consideration of scallop-type growth in SLID
4.3 A simple model for the growth of mono-size hemispheres
4.4 Theory of flux-driven ripening
4.5 Measurement of the nano-channel width between two scallops
4.6 Extremely rapid grain growth in scallop-type Cu6Sn5 in SLID
References
Figures Caption
Problems
Chapter 5 Solid State Reactions between Solder and Copper
5.1 Introduction
5.2 Layer-type growth of IMC in solid state reaction
5.3 Wagner diffusivity
5.4 Kirkendall void formation in Cu3Sn
5.5 Side wall reaction to form porous Cu3Sn in micro-bumps
5.6 Effect of surface diffusion on IMC formation in pillar-type micro-bumps
References
Figures Caption
Problems
Part II (Chapter 6 to Chapter 8)
Chapter 6 Essence of Integrated Circuits and Packaging Design
6.1 Introduction
6.2 Transistor and Interconnect Sca…