A Guide to Analog ASICs is a working reference for the engineer who regularly uses analog custom technology or plans to use it in a product. The book includes a detailed analysis of analog and digital application specific integrated circuits (ASICs), the vendor selection process, cost trade-offs, and design-options (in-house, design center, use of vendor design resources). After introducing the development of analog ASICs, ASIC vendors, development cycles, and cost considerations, the text reviews basic global semiconductor technology, IC fabrication techniques, and the limitations of linear IC design. The components found inside the chip are integrated resistors, capacitors, transistors, diodes, and metal connections. The text explains building block circuits, how these are used to construct complex circuitry, and how the Simulation Program with Integrated Circuit Emphasis (SPICE) can check for circuit performance. The selection of the chip's package is important and depends on several factors, such as thermal size, physical size, PC board technology, number of pins, die size. When tested, a typical product should have a failure rate that follows a curve composed of a failure rate (X-axis) versus time (Y-axis). The book also provides suggestions on vendor selections including vendor identification, site visitation, and price negotiations. The book is suitable for computer engineers, designers of industrial processes, and researchers involved in electrical, computer, or other devices using integrated circuits.
Inhalt
Preface
Chapter 1 An Introduction to Analog ASICs
1.0 A Historical Look at Analog ASICs
1.1 Analog ASIC Products and Development Cycles
1.2 Vendors and Product Offerings
Chapter 2 Integrated Circuit Fabrication Technology
2.0 Silicon-The Material
2.1 pn Junctions
2.2 Bipolar Transistor Operation
2.3 Semiconductor Processing
References
Chapter 3 Integrated Circuit Components
3.0 Introduction
3.1 pn Junctions
3.2 Resistors
3.3 Bipolar Transistors
3.4 Diodes
3.5 Junction Field-Effect Transistors
3.6 Capacitors
3.7 Metal Interconnection
3.8 Parasitic Effects
References
Chapter 4 SPICE Simulation
4.0 Introduction to SPICE
4.1 SPICE Analysis
4.2 SPICE Input Format
4.3 Passive Components
4.4 Current and Voltage Sources
4.5 Active Components
4.6 Subcircuits
4.7 Analysis Control
4.8 Output Control
4.9 Typical Model Parameters
References
Chapter 5 Circuit Design
5.0 Introduction to Linear Integrated Design
5.1 Current Sources and Biasing Techniques
5.2 Voltage References
5.3 Amplifiers
5.4 Oscillators
5.5 Nonlinear Circuits
5.6 Timers
5.7 Logic Circuits
5.8 Circuit Configurations
5.9 Worst-Case Considerations
References
Chapter 6 Integrated Circuit Layout Considerations
6.0 Introduction
6.1 Choosing the Array
6.2 Macro (Chip-Level) Layout
6.3 Micro (Circuit-Level) Layout
Chapter 7 Packaging
7.0 Introduction
7.1 Packaging Options
7.2 Thermal Design
7.3 Package Selection
References
Chapter 8 Testing
8.0 Introduction
8.1 Electrical Testing
8.2 Environmental Testing/Quality Assurance
Chapter 9 Custom IC Economics
9.0 Introduction
9.1 Defining the Custom IC
9.2 Estimating the Value of a Custom IC
9.3 Estimating the Cost of a Custom IC
9.4 Making Decisions
Chapter 10 Choosing an ASIC Vendor
10.0 Introduction
10.1 Initial Screening
10.2 Questions to Ask Potential Vendors
10.3 Vendor Facility Visit
10.4 Negotiating
10.5 Managing the Development
Index