Electrostatic discharge (ESD) continues to impact semiconductor
manufacturing, semiconductor components and systems, as
technologies scale from micro- to nano electronics. This book
introduces the fundamentals of ESD, electrical overstress (EOS),
electromagnetic interference (EMI), electromagnetic compatibility
(EMC), and latchup, as well as provides a coherent overview of the
semiconductor manufacturing environment and the final system
assembly. It provides an illuminating look into the integration of
ESD protection networks followed by examples in specific
technologies, circuits, and chips.

The text is unique in covering semiconductor chip manufacturing
issues, ESD semiconductor chip design, and system problems
confronted today as well as the future of ESD phenomena and
nano-technology.

Look inside for extensive coverage on:

* The fundamentals of electrostatics, triboelectric charging, and
how they relate to present day manufacturing environments of
micro-electronics to nano-technology

* Semiconductor manufacturing handling and auditing processing to
avoid ESD failures

* ESD, EOS, EMI, EMC, and latchup semiconductor component and
system level testing to demonstrate product resilience from human
body model (HBM), transmission line pulse (TLP), charged device
model (CDM), human metal model (HMM), cable discharge events (CDE),
to system level IEC 61000-4-2 tests

* ESD on-chip design and process manufacturing practices and
solutions to improve ESD semiconductor chip solutions, also
practical off-chip ESD protection and system level solutions to
provide more robust systems

* System level concerns in servers, laptops, disk drives, cell
phones, digital cameras, hand held devices, automobiles, and space
applications

* Examples of ESD design for state-of-the-art technologies,
including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS
(HVCMOS), RF CMOS, smart power, magnetic recording technology,
micro-machines (MEMs) to nano-structures

ESD Basics: From Semiconductor Manufacturing to Product
Use complements the author's series of books on ESD
protection. For those new to the field, it is an essential
reference and a useful insight into the issues that confront modern
technology as we enter the Nano-electronic Era.

Dr. Steven H. Voldman, IEEE Fellow, Vermont, USA. Prolific Wiley writer, Dr. Steven Voldman has been involved with ESD work since 1991. He has been Chairman of the ESD Association WG 5.5 on TLP testing since 2001 and he was Chairman of the SEMATECH ESD Working Group on ESD Technology from 1995 until 1998.
Dr. Voldman worked 25 years at IBM before working at Qimonda in 2007 and then TSMC Corporation in 2008. Currently he holds 181 patents in the areas of ESD and latchup, and has 125 pending. His fields of expertise are electrostatic discharge (ESD) protection, latchup, ESD testing and ESD design. To date, he has worked on many design architectures from SRAM, DRAM, ASICs, Microprocessors, NVRAMs, image processing designs and power technology.

Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips.

The text is unique in covering semiconductor chip manufacturing issues, ESD semiconductor chip design, and system problems confronted today as well as the future of ESD phenomena and nano-technology.

Look inside for extensive coverage on:

• The fundamentals of electrostatics, triboelectric charging, and how they relate to present day manufacturing environments of micro-electronics to nano-technology
• Semiconductor manufacturing handling and auditing processing to avoid ESD failures
• ESD, EOS, EMI, EMC, and latchup semiconductor component and system level testing to demonstrate product resilience from human body model (HBM), transmission line pulse (TLP), charged device model (CDM), human metal model (HMM), cable discharge events (CDE), to system level IEC 61000-4-2 tests
• ESD on-chip design and process manufacturing practices and solutions to improve ESD semiconductor chip solutions, also practical off-chip ESD protection and system level solutions to provide more robust systems
• System level concerns in servers, laptops, disk drives, cell phones, digital cameras, hand held devices, automobiles, and space applications
• Examples of ESD design for state-of-the-art technologies, including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, magnetic recording technology, micro-machines (MEMs) to nano-structures

ESD Basics: From Semiconductor Manufacturing to Product Use complements the author's series of books on ESD protection. For those new to the field, it is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic Era.

About the Author xiii

Preface xv

Acknowledgments xvii

1 Fundamentals of Electrostatics 1

1.1 Introduction 1

1.2 Electrostatics 1

1.2.1 Thales of Miletus and Electrostatic Attraction 2

1.2.2 Electrostatics and the Triboelectric Series 3

1.2.3 Triboelectric Series and Gilbert 4

1.2.4 Triboelectric Series and Gray 4

1.2.5 Triboelectric Series and Dufay 4

1.2.6 Triboelectric Series and Franklin 5

1.2.7 Electrostatics - Symmer and the Human Body Model 5

1.2.8 Electrostatics - Coulomb and Cavendish 5

1.2.9 Electrostatics - Faraday and the Ice Pail Experiment 5

1.2.10 Electrostatics - Faraday and Maxwell 6

1.2.11 Electrostatics - Paschen 6

1.2.12 Electrostatics - Stoney and the "Electron" 6

1.3 Triboelectric Charging - How does it Happen? 7

1.4 Conductors, Semiconductors, and Insulators 8

1.5 Static Dissipative Materials 8

1.6 ESD and Materials 9

1.7 Electrification and Coulomb's Law 9

1.7.1 Electrification by Friction 10

1.7.2 Electrification by Induction 10

1.7.3 Electrification by Conduction 10

1.8 Electromagnetism and Electrodynamics 11

1.9 Electrical Breakdown 11

1.9.1 Electrostatic Discharge and Breakdown 11

1.9.2 Breakdown and Paschen's Law 12

1.9.3 Breakdown and Townsend 12

1.9.4 Breakdown and Toepler's Law 13

1.9.5 Avalanche Breakdown 13

1.10 Electroquasistatics and Magnetoquasistatics 15

1.11 Electrodynamics and Maxwell's Equations 16

1.12 Electrostatic Discharge (ESD) 16

1.13 Electromagnetic Compatibility (EMC) 16

1.14 Electromagnetic Interference (EMI) 16

1.15 Summary and Closing Comments 17

References 17

2 Fundamentals of Manufacturing and Electrostatics 21

2.1 Materials, Tooling, Human Factors, and Electrostatic Discharge 22

2.1.1 Materials and Human Induced Electric Fields 23

2.2 Manufacturing Environment and Tooling 23

2.3 Manufacturing Equipment and ESD Manufacturing Problems 23

2.4 Manufacturing Materials 24

2.5 Measurement and Test Equipment 24

2.5.1 Manufacturing Testing for Compliance 25

2.6 Grounding and Bonding Systems 27

2.7 Worksurfaces 27