This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.

-List of Figures. List of Tables. -Preface. Acknowledgements. -1: Microelectronic Interconnections. 1. Signal transmission on interconnects. 2. On-chip interconnections. 3. Package level interconnections. -2: Interconnect Modeling. 1. Physical foundations for circuit models of interconnections. 2. Lossless transmission line model. 3. Loss transmission line model. 4. Optimum line model selection. -3: Crosstalk Effects in Digital Circuits. 1. Spurious signals. 2. Crosstalk induced delay. 3. Energy dissipation due to crosstalk. 4. Crosstalk effects in logic VLSI circuits. -4: Packaging Interconnects. 1. Packaging structure. 2. Lumped electrical parameter modeling of packages. 3. Circuit modeling from measurement. 4. Power distribution modeling from EM simulation. 5. Simulations of package effects. -5: Techniques for Avoiding Interconnection Noise. 1. The noise detection problem. 2. Brief introduction to the testing of logic circuits. 3. Crosstalk-induced spurious signal detection. 4. Other test techniques.